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ATM Multimode Fiber Transceivers for SONET OC-3/SDH STM-1 in Low Cost 1x9 Package Style Technical Data
Features
* Full Compliance with ATM Forum UNI SONET OC-3 Multimode Fiber Physical Layer Specification * Multisourced 1 x 9 Package Style with Choice of Duplex SC or Duplex ST* Receptacle * Wave Solder and Aqueous Wash Process Compatibility * Manufactured in an ISO 9002 Certified Facility
HFBR-5203/-5203T 800 nm 300 m HFBR-5204/-5204T 1300 nm 500 m HFBR-5205/-5205T 1300 nm 2 km
physical layers for ATM and other services. These transceivers are all supplied in the new industry standard 1x9 SIP package style with either a duplex SC or a duplex ST* connector interface. ATM 2000 m Backbone Links The HFBR-5205/-5205T are 1300 nm products with optical performance compliant with the SONET STS-3c (OC-3) Physical Layer Interface Specification. This physical layer is defined in the ATM Forum User-Network Interface (UNI) Specification Version 3.0. This document references the ANSI T1E1.2 specification for the details of the interface for 2000 meter multimode fiber backbone links. Selected versions of these transceivers may be used to implement the ATM Forum UNI Physical Layer Interface at the 155 Mbps/194 MBd rate. The ATM 100 Mbps/125 MBd Physical Layer interface is best implemented with the HFBR-5100 family of FDDI Transceivers which are specified for use in this 4B/5B encoded physical layer per the FDDI PMD standard.
Applications
* Multimode Fiber ATM Backbone Links * Multimode Fiber ATM Wiring Closet to Desktop Links * Very Low Cost Multimode Fiber 800 nm ATM Wiring Closet to Desktop Links * ATM 155 Mbps/194 MBd Encoded Links (available upon special request)
ATM 500 m Backbone and Desktop Links The HFBR-5204/-5204T are 1300 nm products which are similar to the HFBR-5205/5205T except that they are intended to provide a lower cost SONET OC-3 link to distances up to 500 meters in 62.5/125 m multimode fiber optic cables. Very Low Cost ATM 300 m Desktop Links The HFBR-5203/-5203T are very low cost 800 nm alternatives to the HFBR-5204/-5204T for SONET OC-3 links to distances up to 300 meters in 62.5/125 m multimode fiber optic cables. Transmitter Sections The transmitter sections of the HFBR-5204 and HFBR-5205 series utilize 1300 nm InGaAsP LEDs and the HFBR-5203 series 107
Description
The HFBR-5200 family of transceivers from Hewlett-Packard provide the system designer with products to implement a range of solutions for multimode fiber SONET OC-3 (SDH STM-1) 5965-9729E (5/97)
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
uses a low cost 800 nm AlGaAs LED. These LEDs are packaged in the optical subassembly portion of the transmitter section. They are driven by a custom silicon IC which converts differential PECL logic signals, ECL referenced (shifted) to a +5 Volt supply, into an analog LED drive current. Receiver Sections The receiver sections of the HFBR-5204 and HFBR-5205 series utilize InGaAs PIN photodiodes coupled to a custom silicon transimpedance preamplifier IC. The HFBR-5203 series uses the same preamplifier IC in conjunction with an inexpensive silicon PIN photodiode. These are packaged in the optical subassembly portion of the receiver. These PIN/preamplifier combinations are coupled to a custom quantizer IC which provides the final pulse shaping for the logic output and the Signal Detect function. The data output is differential. The signal detect output is single-ended. Both data and signal detect outputs are PECL compatible, ECL referenced (shifted) to a +5 volt power supply. Package The overall package concept for the HP transceivers consists of three basic elements; the two optical subassemblies, an electrical subassembly, and the housing as illustrated in the block diagrams in Figure 1 and Figure 1a. The package outline drawing and pin out are shown in Figures 2, 2a, and 3. The details of this package outline and pin out are compliant with the multisource definition of the 1x9 SIP. The low profile of the Hewlett-Packard 108
transceiver design complies with the maximum height allowed for the duplex SC connector over the entire length of the package. The optical subassemblies utilize a high volume assembly process together with low cost lens elements which result in a cost effective building block. The electrical subassembly consists of a high volume multilayer printed circuit board on which the IC chips and various surfacemounted passive circuit elements are attached. The package includes internal shields for the electrical and optical subassemblies to insure low EMI emissions and high immunity to external EMI fields. The outer housing including the duplex SC connector or the duplex ST ports is molded of filled non-conductive plastic to provide mechanical strength and electrical isolation. The solder posts of the Hewlett-Packard design are isolated from the circuit design of the transceiver and do not require
connection to a ground plane on the circuit board. The transceiver is attached to a printed circuit board with the nine signal pins and the two solder posts which exit the bottom of the housing. The two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with the duplex or simplex SC or ST connectored fiber cables. Note: The "T" in the product numbers indicates a transceiver with a duplex ST connector receptacle. Product numbers without a "T" indicate transceivers with a duplex SC connector receptacle.
Application Information
The Applications Engineering group in the Hewlett-Packard Optical Communication Division is available to assist you with the technical understanding and design trade-offs associated with these transceivers. You can contact them through your HewlettPackard sales representative.
ELECTRICAL SUBASSEMBLY DIFFERENTIAL DATA OUT SINGLE-ENDED SIGNAL DETECT OUT QUANTIZER IC PREAMP IC
DUPLEX SC RECEPTACLE PIN PHOTODIODE
OPTICAL SUBASSEMBLIES
DIFFERENTIAL DATA IN DRIVER IC
LED
TOP VIEW
Figure 1. Block Diagram.
ELECTRICAL SUBASSEMBLY DIFFERENTIAL DATA OUT SINGLE-ENDED SIGNAL DETECT OUT QUANTIZER IC PREAMP IC
DUPLEX ST RECEPTACLE PIN PHOTODIODE
OPTICAL SUBASSEMBLIES
DIFFERENTIAL DATA IN DRIVER IC
LED
TOP VIEW
Figure 1a. ST Block Diagram.
39.12 MAX. (1.540)
12.70 (0.500)
25.40 MAX. (1.000)
AREA RESERVED FOR PROCESS PLUG
12.70 (0.500)
H
HFBR-5XXX DATE CODE (YYWW) SINGAPORE
3.30 0.38 (0.130 0.015)
+ 0.08 - 0.05 + 0.003 ) (0.030 - 0.002 0.75
10.35 MAX. (0.407)
2.92 (0.115) o 0.46 (9x) (0.018) NOTE 1
18.52 (0.729) 4.14 (0.163)
+ 0.25 - 0.05 + 0.010 ) (0.050 - 0.002 NOTE 1 1.27
23.55 (0.927)
20.32 [8x(2.54/.100)] (0.800)
16.70 (0.657)
17.32 20.32 23.32 (0.682) (0.800) (0.918)
0.87 (0.034)
23.24 (0.915)
15.88 (0.625)
NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING. DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 2. Package Outline Drawing.
109
42 MAX. (1.654) 24.8 (0.976) 5.99 (0.236)
25.4 MAX. (1.000)
12.7 (0.500)
HFBR-5103T DATE CODE (YYWW) SINGAPORE
12.0 MAX. (0.471)
+ 0.08 0.5 - 0.05 (0.020) + 0.003 - 0.002
(
(
3.2 (0.126) 0.46 (0.022) NOTE 1
20.32 0.38 ( 0.015) 2.6 (0.102)
3.3 0.38 (0.130) ( 0.015) + 0.25 - 0.05 + 0.010 - 0.002
20.32 17.4 [(8x (2.54/0.100)] (0.800) (0.685) 22.86 21.4 (0.900) (0.843)
(
20.32 (0.800)
(
3.6 (0.142)
1.3 (0.051) 23.38 (0.921) 18.62 (0.733)
NOTE 1: PHOSPHOR BRONZE IS THE BASE MATERIAL FOR THE POSTS & PINS WITH TIN LEAD OVER NICKEL PLATING. DIMENSIONS IN MILLIMETERS (INCHES).
Figure 2a. ST Package Outline Drawing.
1 = VEE 2 = RD 3 = RD 4 = SD 5 = VCC 6 = VCC 7 = TD 8 = TD N/C 9 = VEE TOP VIEW N/C
Figure 3. Pin Out Diagram.
110
The following information is provided to answer some of the most common questions about the use of these parts. Transceiver Optical Power Budget versus Link Length Optical Power Budget (OPB) is the available optical power for a fiber optic link to accommodate fiber cable losses plus losses due to in-line connectors, splices, optical switches, and to provide margin for link aging and unplanned losses due to cable plant reconfiguration or repair. Figure 4 illustrates the predicted OPB associated with the three transceivers series specified in this data sheet at the Beginning of Life (BOL). These curves represent the attenuation and chromatic plus modal dispersion losses associated with the 62.5/125 m and 50/125 m fiber cables only. The area under the curves represents the remaining OPB at any link length, which is available for overcoming non-fiber cable losses.
Hewlett-Packard LED technology has produced 800 nm LED and 1300 nm LED devices with lower aging characteristics than normally associated with these technologies in the industry. The industry convention is 3 dB aging for 800 nm and 1.5 dB aging for 1300 nm LEDs. The 1300 nm HP LEDs are specified to experience less than 1 dB of aging over normal commercial equipment mission life periods. Contact your Hewlett-Packard sales representative for additional details. Figure 4 was generated for the 1300 nm transceivers with a Hewlett-Packard fiber optic link model containing the current industry conventions for fiber cable specifications and the draft ANSI T1E1.2. These optical parameters are reflected in the guaranteed performance of the transceiver specifications in this data sheet. This same model has been used extensively in the ANSI and IEEE committees, including the ANSI T1E1.2 committee, to establish the optical performance requirements for various fiber
optic interface standards. The cable parameters used come from the ISO/IEC JTC1/SC 25/WG3 Generic Cabling for Customer Premises per DIS 11801 document and the EIA/TIA-568-A Commercial Building Telecommunications Cabling Standard per SP-2840. The HFBR-5203 series 800 nm transceiver curve in Figure 4 was generated based on extensive empirical test data of the 800 nm transceiver performance. The curve includes the effect of typical fiber attenuation, plus receiver sensitivity loss due to chromatic and metal dispersion losses through the fiber. Transceiver Signaling Operating Rate Range and BER Performance For purposes of definition, the symbol (Baud) rate, also called signaling rate, is the reciprocal of the symbol time. Data rate (bits/ sec) is the symbol rate divided by the encoding factor used to encode the data (symbols/bit). When used in 155 Mbps SONET OC-3 applications the performance of the 1300 nm transceivers, HFBR-5204/5205 is guaranteed to the full conditions listed in individual product specification tables. The transceivers may be used for other applications at signaling rates different than 155 Mbps with some variation in the link optical power budget. Figure 5 gives an indication of the typical performance of these products at different rates.
12
HFBR-5205, 62.5/125 m
OPTICAL POWER BUDGET (dB)
10
HFBR-5203, 62.5/125 m
8
HFBR-5205, 50/125 m
6 HFBR-5203,
50/125 m
4
HFBR-5204, 62.5/125 m
2
HFBR-5204, 50/125 m
0
0.3 0.5
1.0
1.5
2.0
2.5
FIBER OPTIC CABLE LENGTH (km)
Figure 4. Optical Power Budget vs. Fiber Optic Cable Length.
These transceivers can also be used for applications which require different Bit Error Rate (BER) performance. Figure 6 111
TRANSCEIVER RELATIVE OPTICAL POWER BUDGET AT CONSTANT BER (dB)
2.5
1 x 10-2
2.0
1 x 10-3
BIT ERROR RATE
1.5
1 x 10-4 1 x 10-5 1 x 10-6 1 x 10-7 1 x 10-8 1 x 10-9 1 x 10-10 1 x 10-11 1 x 10-12 -6 -4
1.0
HFBR-5203/5204/5205 SERIES CENTER OF SYMBOL
0.5
0
0.5 0 25 50 75 100 125 150 175 200 SIGNAL RATE (MBd) CONDITIONS: 1. PRBS 27-1 2. DATA SAMPLED AT CENTER OF DATA SYMBOL. 3. BER = 10-6 4. TA = 25 C 5. VCC = 5 Vdc 6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
-2
0
2
4
RELATIVE INPUT OPTICAL POWER - dB CONDITIONS: 1. 155 MBd 2. PRBS 27-1 3. CENTER OF SYMBOL SAMPLING. 4. TA = 25 C 5. VCC = 5 Vdc 6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
Figure 5. Transceiver Relative Optical Power Budget at Constant BER vs. Signaling Rate.
Figure 6. Bit Error Rate vs. Relative Receiver Input Optical Power.
illustrates the typical trade-off between link BER and the receivers input optical power level. Transceiver Jitter Performance The Hewlett-Packard 1300 nm transceivers are designed to operate per the system jitter allocations stated in Table B1 of Annex B of the draft ANSI T1E1.2 Revision 3 standard. The HP 1300 nm transmitters will tolerate the worst case input electrical jitter allowed in Annex B without violating the worst case output optical jitter requirements. The HP 1300 nm receivers will tolerate the worst case input optical jitter allowed in Annex B
without violating the worst case output electrical jitter allowed. The jitter specifications stated in the following 1300 nm transceiver specification tables are derived from the values in Table B1 of Annex B. They represent the worst case jitter contribution that the transceivers are allowed to make to the overall system jitter without violating the Annex B allocation example. In practice, the typical contribution of the HP transceivers is well below these maximum allowed amounts. Recommended Handling Precautions Hewlett-Packard recommends that normal static precautions be taken in the handling and assembly of these transceivers to prevent damage which may be induced by electrostatic discharge
(ESD). The HFBR-5200 series of transceivers meet MIL-STD-883C Method 3015.4 Class 2 products. Care should be used to avoid shorting the receiver data or signal detect outputs directly to ground without proper current limiting impedance. Solder and Wash Process Compatibility The transceivers are delivered with protective process plugs inserted into the duplex SC or duplex ST connector receptacle. This process plug protects the optical subassemblies during wave solder and aqueous wash processing and acts as a dust cover during shipping. These transceivers are compatible with either industry standard wave or hand solder processes.
112
, , , ,, ,
NO INTERNAL CONNECTION NO INTERNAL CONNECTION HFBR-520X TOP VIEW Rx VEE 1 RD 2 RD 3 SD 4 Rx VCC 5 Tx VCC 6 TD 7 TD 8 Tx VEE 9 C1 C2 TERMINATION AT PHY DEVICE INPUTS L1 L2 VCC R2 R3 VCC C3 C4 R1 R4 R5 R7
VCC FILTER AT VCC PINS TRANSCEIVER
C5
C6
R6
R8
R9
R10
TERMINATION AT TRANSCEIVER INPUTS
RD
RD
SD
VCC
TD
TD
NOTES: THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED. R1 = R4 = R6 = R8 = R10 = 130 OHMS. R2 = R3 = R5 = R7 = R9 = 82 OHMS. C1 = C2 = C3 = C5 = C6 = 0.1 F. C4 = 10 F. L1 = L2 = 1 H COIL OR FERRITE INDUCTOR.
Figure 7. Recommended Decoupling and Termination Circuits.
Shipping Container The transceiver is packaged in a shipping container designed to protect it from mechanical and ESD damage during shipment or storage. Board Layout - Decoupling Circuit and Ground Planes It is important to take care in the layout of your circuit board to achieve optimum performance from these transceivers. Figure 7
provides a good example of a schematic for a power supply decoupling circuit that works well with these parts. It is further recommended that a contiguous ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. This recommendation is in keeping with good high frequency board layout practices.
Board Layout - Hole Pattern The Hewlett-Packard transceiver complies with the circuit board "Common Transceiver Footprint" hole pattern defined in the original multisource announcement which defined the 1x9 package style. This drawing is reproduced in Figure 8 with the addition of ANSI Y14.5M compliant dimensioning to be used as a guide in the mechanical layout of your circuit board. 113
(2X) o 20.32 .800
1.9 0.1 .075 .004 MA
-A-
O0.000
20.32 .800
(9X) o
0.8 0.1 .032 .004 MA
O0.000
(8X)
2.54 .100 TOP VIEW
Figure 8. Recommended Board Layout Hole Pattern.
Board Layout - Art Work The Applications Engineering group is developing Gerber file art work for a multilayer printed circuit board layout incorporating the recommendations above. Contact your local HewlettPackard sales representative for details. Board Layout - Mechanical For applications interested in providing a choice of either a duplex SC or a duplex ST connector interface, while utilizing the same pinout on the printed circuit board, the ST port needs to protrude from the chassis panel a minimum of 9.53 nm for sufficient clearance to install the ST connector. Please refer to Figure 8a for a mechanical layout detailing the 114
recommended location of the duplex SC and duplex ST transceiver packages in relation to the chassis panel.
Regulatory Compliance
These transceiver products are intended to enable commercial system designers to develop equipment that complies with the various international regulations governing certification of Information Technology Equipment. See the Regulatory Compliance Table for details. Additional information is available from your Hewlett-Packard sales representative. Electrostatic Discharge (ESD) There are two design cases in which immunity to ESD damage is important.
The first case is during handling of the transceiver prior to mounting it on the circuit board. It is important to use normal ESD handling precautions for ESD sensitive devices. These precautions include using grounded wrist straps, work benches, and floor mats in ESD controlled areas. The second case to consider is static discharges to the exterior of the equipment chassis containing the transceiver parts. To the extent that the duplex SC connector is exposed to the outside of the equipment chassis it may be subject to whatever ESD system level test criteria that the equipment is intended to meet.
12.0 0.51
11.1 0.75
NOTE 1: MINIMUM DISTANCE FROM FRONT OF CONNECTOR TO THE PANEL FACE.
Figure 8a. Recommended Common Mechanical Layout for ST and ST 1x9 Connectored Transceivers.
, , , , , ,
9.53 (NOTE 1) 12.09 6.79
42.0
24.8
Electromagnetic Interference (EMI) Most equipment designs utilizing these high speed transceivers from Hewlett-Packard will be required to meet the requirements of FCC in the United States, CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan.
25.4
These products are suitable for use in designs ranging from a desktop computer with a single transceiver to a concentrator or switch product with large number of transceivers. In all well-designed chassis, the two 0.5" holes required for ST connectors to protrude through, will provide 4.6 dB more shielding than one 1.2" duplex SC rectangular cutout. Thus, in a well-designed chassis, the duplex ST 1x9 transceiver emissions will be identical to the duplex SC 1x9 transceiver emissions. Immunity Equipment utilizing these transceivers will be subject to radiofrequency electromagnetic fields in some environments. These transceivers have a high immunity to such fields. For additional information regarding EMI, susceptibility, ESD and conducted noise testing procedures and results on the 1x9 transceiver family, please refer to Applications Note 1075, Testing and Measuring Electromagnetic Compatibility Performance of the HFBR510X/-520X Fiber Optic Transceivers.
39.12
25.4
115
200
5
180 1.0 160
3.0
RELATIVE INPUT OPTICAL POWER (dB)
- TRANSMITTER OUTPUT OPTICAL SPECTRAL WIDTH (FWHM) -nm
4
3 HFBR-5203/-5204/-5205 SERIES 2
1.5
140
2.0 2.5 3.0 tr/f - TRANSMITTER OUTPUT OPTICAL RISE/FALL TIMES - ns
120
1
100 1260
0 -3 -2 -1 0 1 2 3
1280
1300
1320
1340
1360
C - TRANSMITTER OUTPUT OPTICAL CENTER WAVELENGTH -nm HFBR-5205 TRANSMITTER TEST RESULTS OF C, AND tr/f ARE CORRELATED AND COMPLY WITH THE ALLOWED SPECTRAL WIDTH AS A FUNCTION OF CENTER WAVELENGTH FOR VARIOUS RISE AND FALL TIMES.
EYE SAMPLING TIME POSITION (ns) CONDITIONS: 1.TA = 25 C 2. VCC = 5 Vdc 3. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns. 4. INPUT OPTICAL POWER IS NORMALIZED TO CENTER OF DATA SYMBOL. 5. NOTE 16 AND 17 APPLY.
Figure 9. Transmitter Output Optical Spectral Width (FWHM) vs. Transmitter Output Optical Center Wavelength and Rise/Fall Times.
Figure 10. Relative Input Optical Power vs. Eye Sampling Time Position.
Regulatory Compliance Table
Feature Electrostatic Discharge (ESD) to the Electrical Pins Electrostatic Discharge (ESD) to the Duplex SC Receptacle Electromagnetic Interference (EMI) Test Method MIL-STD-883C Method 3015.4 Variation of IEC 801-2 FCC Class B CENELEC EN55022 Class B (CISPR 22B) VCCI Class 2 Performance Meets Class 2 (2000 to 3999 Volts) Withstand up to 2200 V applied between electrical pins. Typically withstand at least 25 kV without damage when the Duplex SC Connector Receptacle is contacted by a Human Body Model probe. Transceivers typically provide a 13 dB margin (with duplex SC receptacle) or a 9 dB margin (with duplex ST receptacles) to the noted standard limits when tested at a certified test range with the transceiver mounted to a circuit card without a chassis enclosure. Typically show no measurable effect from a 10 V/m field swept from 10 to 450 MHz applied to the transceiver when mounted to a circuit card without a chassis enclosure.
Immunity
Variation of IEC 801-3
116
Transceiver Reliability and Performance Qualification Data
The 1 x 9 transceivers have passed Hewlett-Packard reliability and performance qualification testing and are undergoing ongoing quality monitoring. Details are available from your Hewlett-Packard sales representative. These transceivers are manufactured at the HewlettPackard Singapore location which is an ISO 9002 certified facility.
and Authorized Distributors world wide. Applications Support Materials Contact your local HewlettPackard Component Field Sales Office for information on how to obtain PCB Layouts, Test Boards and demo boards for the 1x9 transceivers. Evaluation Kits Hewlett-Packard has available three evaluation kits for the 1x9 transceivers. The purpose of these kits is to provide the necessary materials to evaluate the performance of the HFBR-520X family in a pre-existing 1x13 or 2x11 pinout system design configuration or when connectored to various test equipment.
1. HFBR-0305 - ATM Evaluation Kit: This kit consists of one HFBR5205, one 1 x 13 to 1 x 9 pin out adapter card, and one three meter duplex SC to duplex ST connectored 62.5/125 m fiber optic cable. 2. HFBR-0303 - FDDI Evaluation Kit: This kit consists of one HFBR5103, one 2 x 11 to 1 x 9 pin out adapter card, one 1 x 13 to 1 x 9 pin out adapter card, and one three meter duplex SC to MIC/ Receptacle connectored 62.5/ 125 m fiber optic cable. 3. HFBR-0319 - Evaluation Test Fixture Board: This test fixture converts +5 V ECL 1x9 transceivers to -5 V ECL BNC Coax Connections so that direct connections to industry standard fiber optic test equipment can be accomplished.
Ordering Information
The HFBR-5204/-5204T and HFBR-5205/-5205T 1300 nm products and the HFBR-5203/ -5203T 800 transceivers are available for production orders through the Hewlett-Packard Component Field Sales Offices
117
HFBR-5203, -5204, and -5205 Series Absolute Maximum Ratings
Parameter Storage Temperature Lead Soldering Temperature Lead Soldering Time Supply Voltage Data Input Voltage Differential Input Voltage Output Current Symbol TS TSOLD tSOLD VCC VI VD IO -0.5 -0.5 Min. -40 Typ. Max. 100 260 10 7.0 VCC 1.4 50 Unit C C sec. V V V mA Note 1 Reference
HFBR-5203, -5204, and -5205 Series Recommended Operating Conditions
Parameter Ambient Operating Temperature Supply Voltage Data Input Voltage - Low Data Input Voltage - High Data and Signal Detect Output Load Symbol TA VCC VIL - VCC VIH - VCC RL Min. 0 4.75 -1.810 -1.165 50 Typ. Max. 70 5.25 -1.475 -0.880 Unit C V V V Note 2 Reference
118
Accessory Duplex SC Connectored Cable Assemblies Hewlett-Packard recommends for optimal coupling the use of flexible-body duplex SC connectored cable. Hewlett-Packard offers two such compatible Duplex SC connectored jumper cable assemblies to assist you in the evaluation of these transceiver products. These cables may be purchased from HP with the following part numbers.
1. HFBR-BKD001 A duplex cable 1 meter long assembled with 62.5/125 m fiber and Duplex SC connector plugs on both ends. 2. HFBR-BKD010 A duplex cable 10 meters long assembled with 62.5/125 m fiber and Duplex SC connector plugs on both ends.
HFBR-5203, -5204 and -5205 Series Transmitter Electrical Characteristics
(TA = 0C to 70C, VCC = 4.75 V to 5.25 V) Parameter Supply Current Power Dissipation Data Input Current - Low Data Input Current - High Symbol ICC PDISS IIL IIH -350 Min. Typ. 145 0.76 0 14 350 Max. 185 0.97 Unit mA W A A Reference Note 3
HFBR-5203, -5204 and -5205 Series Receiver Electrical Characteristics
(TA = 0C to 70C, VCC = 4.75 V to 5.25 V) Parameter Supply Current Power Dissipation Data Output Voltage - Low Data Output Voltage - High Data Output Rise Time Data Output Fall Time Signal Detect Output Voltage - Low Signal Detect Output Voltage - High Signal Detect Output Rise Time Signal Detect Output Fall Time Symbol ICC PDISS VOL - VCC VOH - VCC tr tf VOL - VCC VOH - VCC tr tf -1.840 -1.045 0.35 0.35 -1.840 -1.045 0.35 0.35 Min. Typ. 82 0.3 Max. 145 0.5 -1.620 -0.880 2.2 2.2 -1.620 -0.880 2.2 2.2 Unit mA W V V ns ns V V ns ns Reference Note 4 Note 5 Note 6 Note 6 Note 7 Note 7 Note 6 Note 6 Note 7 Note 7
119
Accessory Duplex ST Connectored Cable Assemblies Hewlett-Packard recommends the use of Duplex Push-Pull ST connectored cable for optimal repeatibility of the optical power coupling. Hewlett-Packard offers two such compatible duplex PushPull ST connectored jumper cable assemblies to assist you in your evaluation of these products. These cables may be purchased from HP with the following part numbers. 1. HFBR-XXX001 A duplex cable 1 meter long assembled with 62.5/125 m fiber and Duplex Push-Pull ST connector plugs on both ends. 2. HFBR-XXX010 A duplex cable 10 meters long assembled with 62.5/125 m fiber and Duplex Push-Pull ST connector plugs on both ends.
120
HFBR-5203/-5203T Transmitter Optical Characteristics
(TA = 0C to 70C, VCC = 4.75 V to 5.25 V) Parameter Output Optical Power BOL 62.5/125 m, NA = 0.275 Fiber EOL Output Optical Power 50/125 m, NA = 0.20 Fiber Optical Extinction Ratio Output Optical Power at Logic "0" State Center Wavelength Spectral Width - FWHM - nm RMS Optical Rise Time Optical Fall Time Systematic Jitter Contributed by the Transmitter Random Jitter Contributed by the Transmitter PO ("0") C tr tf SJ RJ 800 BOL EOL Symbol PO PO Min. -17 -20 -20.8 -23.8 Typ. Max. -12 -12 0.01 -40 -45 900 100 43 4.5 4.5 1.7 0.52 Unit dBm avg. dBm avg. % dB dBm avg. nm nm nm RMS ns ns ns p-p ns p-p Note 12 Note 13 Note 13 Note 14 Note 15 Reference Note 9 Note 9 Note 10 Note 11
HFBR-5203/-5203T Receiver Optical and Electrical Characteristics
(TA = 0C to 70C, VCC = 4.75 V to 5.25 V) Parameter Input Optical Power Minimum at Window Edge Output Optical Power Minimum at Eye Center Input Optical Power Maximum Operating Wavelength Systematic Jitter Contributed by the Receiver Random Jitter Contributed by the Receiver Signal Detect - Asserted Signal Detect - Deasserted Signal Detect - Hysteresis Signal Detect Assert Time (off to on) Signal Detect Deassert Time (on to off) Symbol PIN Min. (W) PIN Min. (C) PIN Max. SJ RJ PA PD PA - PD PD + 1.5 dB -45 1.5 0 0 100 350 -12 800 900 0.9 1.16 -28 PA-1.5 Min. Typ. Max. -26 -27 Unit dBm avg. dBm avg. dBm avg. nm ns p-p ns p-p dBm avg. dBm avg. dB s s Note 22 Note 23 Note 18 Note 19 Note 20 Note 21 Reference Note 16 Note 17 Note 16
121
HFBR-5204/-5204T Transmitter Optical Characteristics
(TA = 0C to 70C, VCC = 4.75 V to 5.25 V) Parameter Output Optical Power BOL 62.5/125 m, NA = 0.275 Fiber EOL Output Optical Power 50/125 m, NA = 0.20 Fiber Optical Extinction Ratio Output Optical Power at Logic "0" State Center Wavelength Spectral Width - FWHM - nm RMS Optical Rise Time Optical Fall Time Systematic Jitter Contributed by the Transmitter Random Jitter Contributed by the Transmitter PO ("0") C tr tf SJ RJ 0.04 0 1270 1310 BOL EOL Symbol PO PO Min. -21 -22 -24.5 -25.5 Typ. Max. -14 -14 0.03 -35 -45 1380 250 107 4 4 1.2 0.52 Unit dBm avg. dBm avg. % dB dBm avg. nm nm nm RMS ns ns ns p-p ns p-p Note 12 Note 13 Note 13 Note 14 Note 15 Reference Note 8 Note 8 Note 10 Note 11
HFBR-5204/-5204T Receiver Optical and Electrical Characteristics
(TA = 0C to 70C, VCC = 4.75 V to 5.25 V) Parameter Input Optical Power Minimum at Window Edge Input Optical Power Minimum at Eye Center Input Optical Power Maximum Systematic Jitter Contributed by the Receiver Random Jitter Contributed by the Receiver Operating Wavelength Signal Detect - Asserted Signal Detect - Deasserted Signal Detect - Hysteresis Signal Detect Assert Time (off to on) Signal Detect Deassert Time (on to off) Symbol PIN Min. (W) PIN Min. (C) PIN Max. SJ RJ PA PD PA - PD 1270 PD + 1.5 dB -45 1.5 0 0 55 110 100 350 -14 0.2 1 1.2 1.91 1380 -31 Min. Typ. Max. -29 -30 Unit dBm avg. dBm avg. dBm avg. ns p-p ns p-p nm dBm avg. dBm avg. dB s s Note 22 Note 23 Note 20 Note 21 Reference Note 16 Figure 10 Note 17 Figure 10 Note 16 Note 18 Note 19
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HFBR-5205/-5205T Transmitter Optical Characteristics
(TA = 0C to 70C, VCC = 4.75 V to 5.25 V) Parameter Output Optical Power 62.5/125 m, NA = 0.275 Fiber Output Optical Power 50/125 m, NA = 0.20 Fiber Optical Extinction Ratio Output Optical Power at Logic "0" State Center Wavelength Spectral Width - FWHM - nm RMS Optical Rise Time Optical Fall Time Systematic Jitter Contributed by the Transmitter Random Jitter Contributed by the Transmitter PO ("0") C tr tf SJ RJ 0.6 0.6 1270 1310 137 58 1.0 2.1 0.04 0 3.0 3.0 1.2 0.52 BOL EOL BOL EOL Symbol PO PO Min. -19 -20 -22.5 -23.5 0.001 -50 Typ. Max. -14 -14 0.03 -35 -45 1380 Unit dBm avg. dBm avg. % dB dBm avg. nm nm nm RMS ns ns ns p-p ns p-p Reference Note 9 Note 9 Note 10 Note 11 Note 24 Figure 9 Note 24 Figure 9 Note 12, 24 Figure 9 Note 12, 24 Figure 9 Note 14 Note 15
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HFBR-5205/-5205T Receiver Optical and Electrical Characteristics
(TA = 0C to 70C, VCC = 4.75 V to 5.25 V) Parameter Input Optical Power Minimum at Window Edge Input Optical Power Minimum at Eye Center Input Optical Power Maximum Operating Wavelength Systematic Jitter Contributed by the Receiver Random Jitter Contributed by the Receiver Signal Detect - Asserted Signal Detect - Deasserted Signal Detect - Hysteresis Signal Detect Assert Time (off to on) Signal Detect Deassert Time (on to off) Symbol PIN Min. (W) PIN Min. (C) PIN Max. SJ RJ PA PD PA - PD PD + 1.5 dB -45 1.5 0 0 55 110 100 350 -14 1260 0.2 1 1360 1.2 1.91 -31 Min. Typ. Max. -30 -31 Unit dBm avg. dBm avg. dBm avg. nm ns p-p ns p-p dBm avg. dBm avg. dB s s Note 22 Note 23 Note 18 Note 19 Note 20 Note 21 Reference Note 16 Figure 10 Note 17 Figure 10 Note 16
Notes: 1. This is the maximum voltage that can be applied across the Differential Transmitter Data Inputs to prevent damage to the input ESD protection circuit. 2. The outputs are terminated with 50 connected to VCC -2 V. 3. The power supply current needed to operate the transmitter is provided to differential ECL circuitry. This circuitry maintains a nearly constant current flow from the power supply. Constant current operation helps to prevent unwanted electrical noise from being generated and conducted or emitted to neighboring circuitry. 4. This value is measured with the outputs terminated into 50 connected to VCC -2 V and an Input Optical Power level of -14 dBm average. 5. The power dissipation value is the power dissipated in the receiver itself. Power dissipation is calculated as the sum of the products of supply voltage and currents, minus
the sum of the products of the output voltages and currents. 6. This value is measured with respect to VCC with the output terminated into 50 connected to VCC -2 V. 7. The output rise and fall times are measured between 20% and 80% levels with the output connected to VCC -2 V through 50 . 8. These optical power values are measured with the following conditions: * The Beginning of Life (BOL) to the End of Life (EOL) optical power degradation is typically 1.5 dB per the industry convention for long wavelength LEDs. The actual degradation observed in Hewlett-Packard's 1300 nm LED products is <1 dB, as specified in this datasheet. * Over the specified operating voltage and temperature ranges. * With 25 MBd (12.5 MHz squarewave) input signal. * At the end of one meter of noted optical fiber with cladding modes removed.
The average power value can be converted to a peak power value by adding 3 dB. Higher output optical power transmitters are available on special request. 9. The same comments of note 9 apply except that industry convention for short wavelength LED (800 nm) aging is 3 dB. This value for Output Optical Power will provide a minimum 6 dB optical power budget at the EOL, which will provide at least 150 meter link lengths with margin left over for overcoming normal passive losses, such as inline connectors, in the cable plant. The actual degradation observed in normal commercial environments will be considerably less than this amount with Hewlett-Packard's 800 nm LED products. Please consult with your local HP sales representative for further details. 10. The Extinction Ratio is a measure of the modulation depth of the optical signal. The data "0" output optical power is compared to the data "1" peak output optical power and
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expressed as a percentage. With the transmitter driven by a 25 MBd (12.5 MHz square-wave) input signal, the average optical power is measured. The data "1" peak power is then calculated by adding 3dB to the measured average optical power. The data "0" output optical power is found by measuring the optical power when the transmitter is driven by a logic "0" input. The extinction ratio is the ratio of the optical power at the "0" level compared to the optical power at the "1" level expressed as a percentage or in decibels. 11. The transmitter will provide this low level of Output Optical Power when driven by a logic "0" input. This can be useful in link troubleshooting. 12. The relationship between Full Width Half Maximum and RMS values for Spectral Width is derived from the assumption of a Gaussian shaped spectrum which results in a 2.35 X RMS = FWHM relationship. 13. The optical rise and fall times are measured from 10% to 90% when the transmitter is driven by a 25 MBd (12.5 MHz square-wave) input signal. The ANSI T1E1.2 committee has designated the possibility of defining an eye pattern mask for the transmitter optical output as an item for further study. HP will incorporate this requirement into the specifications for these products if it is defined. The HFBR-5204 and HFBR-5205 products typically comply with the template requirements of CCITT (now ITU-T) G.957 Section 3.2.5, Figure 2 for the STM1 rate, excluding the optical receiver filter normally associated with single mode fiber measurements which is the likely source for the ANSI T1E1.2 committee to follow in this matter.
14. Systematic Jitter contributed by the transmitter is defined as the combination of Duty Cycle Distortion and Data Dependent Jitter. Systematic Jitter is measured at 50% threshold using a 155.52 MBd (77.5 MHz square-wave), 27 - 1 psuedorandom data pattern input signal. 15. Random Jitter contributed by the transmitter is specified with a 155.52 MBd (77.5 MHz squarewave) input signal. 16. This specification is intended to indicate the performance of the receiver section of the transceiver when Input Optical Power signal characteristics are present per the following definitions. The Input Optical Power dynamic range from the minimum level (with a window time-width) to the maximum level is the range over which the receiver is guaranteed to provide output data with a Bit Error Ratio (BER) better than or equal to 1 x 10-10. * At the Beginning of Life (BOL) * Over the specified operating temperature and voltage ranges * Input is a 155.52 MBd, 223 - 1 PRBS data pattern with 72 "1"s and 72 "0"s inserted per the CCITT (now ITU-T) recommendation G.958 Appendix I. * Receiver data window time-width is 1.23 ns or greater for the clock recovery circuit to operate in. The actual test data window timewidth is set to simulate the effect of worst case optical input jitter based on the transmitter jitter values from the specification tables. The test window timewidths are as follows: HFBR-5203 is 4.4ns, HFBR-5205 and HFBR5204 are 3.32 ns.
* Transmitter operating with a 155.52 MBd, 77.5 MHz squarewave, input signal to simulate any cross-talk present between the transmitter and receiver sections of the transceiver. 17. All conditions of Note 16 apply except that the measurement is made at the center of the symbol with no window time-width. 18. Systematic Jitter contributed by the receiver is defined as the combination of Duty Cycle Distortion and Data Dependent Jitter. Systematic Jitter is measured at 50% threshold using a 155.52 MBd (77.5 MHz square-wave), 27 - 1 psuedorandom data pattern input signal. 19. Random Jitter contributed by the receiver is specified with a 155.52 MBd (77.5 MHz square-wave) input signal. 20. This value is measured during the transition from low to high levels of input optical power. 21. This value is measured during the transition from high to low levels of input optical power. 22. The Signal Detect output shall be asserted within 100 s after a step increase of the Input Optical Power. 23. Signal detect output shall be deasserted within 350 s after a step decrease in the Input Optical Power. 24. The HFBR-5205 transceiver complies with the requirements for the tradeoffs between center wavelength, spectral width, and rise/fall times shown in Figure 9. This figure is derived from the FDDI PMD standard (ISO/IEC 9314-3 : 1990 and ANSI X3.166 - 1990) per the description in ANSI T1E1.2 Revision 3. The interpretation of this figure is that values of Center Wavelength and Spectral Width must lie along the appropriate Optical Rise/Fall Time curve.
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